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MetlWeld

Composite-Materials_Epoxy_MetlWeld

MetlWeld ia a 2-part, equal volume ratio, room temperature curing epoxy adhesive. MetlWeld develops strength earlier than other comparable 1:1 systems and may be used at temps. as low as 50°F. Metal to be bonded should be freshly sanded and clean from grease,wax, oil and other contaminants. Allow 48 hours min. to cure and develop strength at 77°F (longer at cooler temps.) before subjecting to stress. Bonds plain & anondized aluminum, glazed & unglazed ceramic; concrete; copper; glass; galvanized and stainless steel; neoprene rubber and most porous materials. Does not bond acrylic, polyethylene, polypropylene, polystyrene or vinyl plastics.